Design And Simulation Of A Multichip Module
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Design And Simulation Of A Multichip Module
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Author : Mathew B. Nazareth
language : en
Publisher:
Release Date : 1994
Design And Simulation Of A Multichip Module written by Mathew B. Nazareth and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994 with Multichip modules (Microelectronics) categories.
"Electronic packaging has undergone basic changes in the last few years to keep up with an ever increasing demand for speed and miniaturization. Multichip Modules (MCM) represent a class of advanced packaging technologies. This thesis examines various MCM technologies and their relative advantages and disadvantages. Further, the design process for an MCM is presented in detail. The physical design and simulation for the performance (electrical and thermal) is also detailed. A design example ties together all the issues that are relevant to the design of an MCM."--Abstract.
Physical Design For Multichip Modules
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Author : Mysore Sriram
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Physical Design For Multichip Modules written by Mysore Sriram and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
Physical Design for Multichip Modules collects together a large body of important research work that has been conducted in recent years in the area of Multichip Module (MCM) design. The material consists of a survey of published results as well as original work by the authors. All major aspects of MCM physical design are discussed, including interconnect analysis and modeling, system partitioning and placement, and multilayer routing. For readers unfamiliar with MCMs, this book presents an overview of the different MCM technologies available today. An in-depth discussion of various recent approaches to interconnect analysis are also presented. Remaining chapters discuss the problems of partitioning, placement, and multilayer routing, with an emphasis on timing performance. For the first time, data from a wide range of sources is integrated to present a clear picture of a new, challenging and very important research area. For students and researchers looking for interesting research topics, open problems and suggestions for further research are clearly stated. Points of interest include : Clear overview of MCM technology and its relationship to physical design; Emphasis on performance-driven design, with a chapter devoted to recent techniques for rapid performance analysis and modeling of MCM interconnects; Different approaches to multilayer MCM routing collected together and compared for the first time; Explanation of algorithms is not overly mathematical, yet is detailed enough to give readers a clear understanding of the approach; Quantitative data provided wherever possible for comparison of different approaches; A comprehensive list of references to recent literature on MCMs provided.
Conceptual Design Of Multichip Modules And Systems
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Author : Peter A. Sandborn
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-03-14
Conceptual Design Of Multichip Modules And Systems written by Peter A. Sandborn and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-03-14 with Technology & Engineering categories.
Conceptual Design of Multichip Modules and Systems treats activities which take place at the conceptual and specification level of the design of complex multichip systems. These activities include the formalization of design knowledge (information modeling), tradeoff analysis, partitioning, and decision process capture. All of these functions occur prior to the traditional CAD activities of synthesis and physical design. Inherent in the design of electronic modules are tradeoffs which must be understood before feasible technology, material, process, and partitioning choices can be selected. The lack of a complete set of technology information is an especially serious problem in the packaging and interconnect field since the number of technologies, process, and materials is substantial and selecting optimums is arduous and non-trivial if one truly wants a balance in cost and performance. Numerous tradeoff and design decisions have to be made intelligently and quickly at the beginning of the design cycle before physical design work begins. These critical decisions, made within the first 10% of the total design cycle, ultimately define up to 80% of the final product cost. Conceptual Design of Multichip Modules and Systems lays the groundwork for concurrent estimation level analysis including size, routing, electrical performance, thermal performance, cost, reliability, manufacturability, and testing. It will be useful both as a reference for system designers and as a text for those wishing to gain a perspective on the nature of packaging and interconnect design, concurrent engineering, computer-aided design, and system synthesis.
Design And Simulation Of The University Of Arkansas Multichip Module Based Multiprocessor Uamm
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Author : Alfonso Avila
language : en
Publisher:
Release Date : 1994
Design And Simulation Of The University Of Arkansas Multichip Module Based Multiprocessor Uamm written by Alfonso Avila and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994 with Multichip modules (Microelectronics) categories.
High Performance Design Automation For Multi Chip Modules And Packages
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Author : Jun Dong Cho
language : en
Publisher: World Scientific
Release Date : 1996-06-12
High Performance Design Automation For Multi Chip Modules And Packages written by Jun Dong Cho and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996-06-12 with Technology & Engineering categories.
Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to present current and future techniques and algorithms of high performance multichip modules (MCMs) and other packaging methodologies. Innovative technical papers in this book cover design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; and design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems which arise in MCMs and other packages.
Electromagnetic Compatibility Simulation And Design Of Multichip Modules
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Author : Christopher Hayden Hontgas
language : en
Publisher:
Release Date : 1998
Electromagnetic Compatibility Simulation And Design Of Multichip Modules written by Christopher Hayden Hontgas and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998 with Electromagnetic compatibility categories.
Multichip Modules
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Author : Ernest Kuh
language : en
Publisher: World Scientific
Release Date : 1992-03-31
Multichip Modules written by Ernest Kuh and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 1992-03-31 with Technology & Engineering categories.
Multichip Module (MCM) technology has been used in high-end systems, such as mainframe and supercomputers as well as military and space applications for some time. Rapid advances in VLSI technology and novel system architecture concepts have presented both challenges and opportunities for MCM technologists. Recent developments in MCM technology indicate that it will eventually take over much of the electronic packaging currently using printed circuit boards. This collection of articles gives an in-depth study of the state-of-the-art of MCM technology from systems, CAD and technology viewpoints. Written by outstanding experts in their fields, this volume should be considered essential reading.
Introduction To Multichip Modules
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Author : Naveed A. Sherwani
language : en
Publisher: Wiley-Interscience
Release Date : 1995-11-23
Introduction To Multichip Modules written by Naveed A. Sherwani and has been published by Wiley-Interscience this book supported file pdf, txt, epub, kindle and other format this book has been release on 1995-11-23 with Computers categories.
Advantages of MCMs over traditional packaging methods for electronic-based applications in computers, aviation, and the military. Introduction to Multichip Modules discusses both custom built MCMs and programmable MCMs and their role in reducing cost and improving turnaround time. An invaluable resource for students and professionals in electrical engineering who design MCMs and MCM-based systems, and for those in computer science who develop CAD tools for MCMs, this.
Design Modeling And Simulation Of Embedded Capacitors For High Density Printed Wiring Board And Multi Chip Module
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Author : Chian-Wen Chen
language : en
Publisher:
Release Date : 1997
Design Modeling And Simulation Of Embedded Capacitors For High Density Printed Wiring Board And Multi Chip Module written by Chian-Wen Chen and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with categories.
Multi Chip Module Test Strategies
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Author : Yervant Zorian
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Multi Chip Module Test Strategies written by Yervant Zorian and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
MCMs today consist of complex and dense VLSI devices mounted into packages that allow little physical access to internal nodes. The complexity and cost associated with their test and diagnosis are major obstacles to their use. Multi-Chip Module Test Strategies presents state-of-the-art test strategies for MCMs. This volume of original research is designed for engineers interested in practical implementations of MCM test solutions and for designers looking for leading edge test and design-for-testability solutions for their next designs. Multi-Chip Module Test Strategies consists of eight contributions by leading researchers. It is designed to provide a comprehensive and well-balanced coverage of the MCM test domain. Multi-Chip Module Test Strategies has also been published as a special issue of the Journal of Electronic Testing: Theory and Applications (JETTA, Volume 10, Numbers 1 and 2).