Dry Etch Technology
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Atomic Layer Processing
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Author : Thorsten Lill
language : en
Publisher: John Wiley & Sons
Release Date : 2021-06-28
Atomic Layer Processing written by Thorsten Lill and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-06-28 with Technology & Engineering categories.
Learn about fundamental and advanced topics in etching with this practical guide Atomic Layer Processing: Semiconductor Dry Etching Technology delivers a hands-on, one-stop resource for understanding etching technologies and their applications. The distinguished scientist, executive, and author offers readers in-depth information on the various etching technologies used in the semiconductor industry, including thermal, isotropic atomic layer, radical, ion-assisted, and reactive ion etching. The book begins with a brief history of etching technology and the role it has played in the information technology revolution, along with a collection of commonly used terminology in the industry. It then moves on to discuss a variety of different etching techniques, before concluding with discussions of the fundamentals of etching reactor design and newly emerging topics in the field such as the role played by artificial intelligence in the technology. Atomic Layer Processing includes a wide variety of other topics as well, all of which contribute to the author's goal of providing the reader with an atomic-level understanding of dry etching technology sufficient to develop specific solutions for existing and emerging semiconductor technologies. Readers will benefit from: A complete discussion of the fundamentals of how to remove atoms from various surfaces An examination of emerging etching technologies, including laser and electron beam assisted etching A treatment of process control in etching technology and the role played by artificial intelligence Analyses of a wide variety of etching methods, including thermal or vapor etching, isotropic atomic layer etching, radical etching, directional atomic layer etching, and more Perfect for materials scientists, semiconductor physicists, and surface chemists, Atomic Layer Processing will also earn a place in the libraries of engineering scientists in industry and academia, as well as anyone involved with the manufacture of semiconductor technology. The author's close involvement with corporate research & development and academic research allows the book to offer a uniquely multifaceted approach to the subject.
Dry Etch Technology
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Author : Deepak Ranadive
language : en
Publisher: SPIE-International Society for Optical Engineering
Release Date : 1992
Dry Etch Technology written by Deepak Ranadive and has been published by SPIE-International Society for Optical Engineering this book supported file pdf, txt, epub, kindle and other format this book has been release on 1992 with Technology & Engineering categories.
Dry Etching Technology For Semiconductors
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Author : Kazuo Nojiri
language : en
Publisher: Springer
Release Date : 2014-10-25
Dry Etching Technology For Semiconductors written by Kazuo Nojiri and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-10-25 with Technology & Engineering categories.
This book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits. The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need most, such as detailed etching processes for each material (Si, SiO2, Metal etc) used in semiconductor devices, etching equipment used in manufacturing fabs, explanation of why a particular plasma source and gas chemistry are used for the etching of each material, and how to develop etching processes. The latest, key technologies are also described, such as 3D IC Etching, Dual Damascene Etching, Low-k Etching, Hi-k/Metal Gate Etching, FinFET Etching, Double Patterning etc.
Dry Etching For Microelectronics
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Author : R.A. Powell
language : en
Publisher: Elsevier
Release Date : 2012-12-02
Dry Etching For Microelectronics written by R.A. Powell and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-02 with Technology & Engineering categories.
This volume collects together for the first time a series of in-depth, critical reviews of important topics in dry etching, such as dry processing of III-V compound semiconductors, dry etching of refractory metal silicides and dry etching aluminium and aluminium alloys. This topical format provides the reader with more specialised information and references than found in a general review article. In addition, it presents a broad perspective which would otherwise have to be gained by reading a large number of individual research papers. An additional important and unique feature of this book is the inclusion of an extensive literature review of dry processing, compiled by search of computerized data bases. A subject index allows ready access to the key points raised in each of the chapters.
Etching In Microsystem Technology
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Author : Michael Köhler
language : en
Publisher: John Wiley & Sons
Release Date : 2008-07-11
Etching In Microsystem Technology written by Michael Köhler and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2008-07-11 with Science categories.
Microcomponents and microdevices are increasingly finding application in everyday life. The specific functions of all modern microdevices depend strongly on the selection and combination of the materials used in their construction, i.e., the chemical and physical solid-state properties of these materials, and their treatment. The precise patterning of various materials, which is normally performed by lithographic etching processes, is a prerequisite for the fabrication of microdevices. The microtechnical etching of functional patterns is a multidisciplinary area, the basis for the etching processes coming from chemistry, physics, and engineering. The book is divided into two sections: the wet and dry etching processes are presented in the first, general, section, which provides the scientific fundamentals, while a catalog of etching bath composition, etching instructions, and parameters can be found in the second section. This section will enhance the comprehension of the general section and also give an overview of data that are essential in practice.
Dry Etching For Vlsi
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Author : A.J. van Roosmalen
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-06-29
Dry Etching For Vlsi written by A.J. van Roosmalen and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-06-29 with Science categories.
This book has been written as part of a series of scientific books being published by Plenum Press. The scope of the series is to review a chosen topic in each volume. To supplement this information, the abstracts to the most important references cited in the text are reprinted, thus allowing the reader to find in-depth material without having to refer to many additional publications. This volume is dedicated to the field of dry (plasma) etching, as applied in silicon semiconductor processing. Although a number of books have appeared dealing with this area of physics and chemistry, these all deal with parts of the field. This book is unique in that it gives a compact, yet complete, in-depth overview of fundamentals, systems, processes, tools, and applications of etching with gas plasmas for VLSI. Examples are given throughout the fundamental sections, in order to give the reader a better insight in the meaning and magnitude of the many parameters relevant to dry etching. Electrical engineering concepts are emphasized to explain the pros and cons of reactor concepts and excitation frequency ranges. In the description of practical applications, extensive use is made of cross-referencing between processes and materials, as well as theory and practice. It is thus intended to provide a total model for understanding dry etching. The book has been written such that no previous knowledge of the subject is required. It is intended as a review of all aspects of dry etching for silicon semiconductor processing.
Plasma Etching
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Author : M. Sugawara
language : en
Publisher: OUP Oxford
Release Date : 1998-05-28
Plasma Etching written by M. Sugawara and has been published by OUP Oxford this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998-05-28 with Technology & Engineering categories.
The focus of this book is the remarkable advances in understanding of low pressure RF (radio frequency) glow discharges. A basic analytical theory and plasma physics are explained. Plasma diagnostics are also covered before the practicalities of etcher use are explored.
Semiconductor Ic Plasma Dry Etching Process
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Author : Kung Linliu
language : en
Publisher: Independently Published
Release Date : 2020-02-11
Semiconductor Ic Plasma Dry Etching Process written by Kung Linliu and has been published by Independently Published this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-02-11 with categories.
Semiconductor market value of 2018 was around 468.8 billion US dollars. It is increased for about 13.7% than year 2017. For 2019, it is estimated decrease about 10% to 13% which is 422 to 408 billion US dollars.This market is in a way winner takes all, for example, TSMC (Taiwan Semiconductor Manufacturing Company) which is the world leading semiconductor foundry company has more than 50% market share. Intel has more than 90% market share of personal computer CPU (Central Process Unit) for many years. However, the semiconductor IC process technology sometimes might change the rule of market. Just recently, AMD (Advanced Micro Devices, Inc.) has more than 17% market share of personal computer CPU because they use foundry of TSMC with 7nm EUV technology node (Extreme Ultraviolet, its wavelength is 13.5 nm, shorter wavelength has better critical dimension (CD) resolution for IC process).For the present time, there are four leading semiconductor companies in the world with EUV technology process node which are as follows: (1)Samsung: the world leading semiconductor IC process company for commodity IC such as DRAM、Flash memory and IC for cell phone. The world leading company in cell phone market share, Samsung has highest volume unit of mobile phone which is 75.1 million unit representing 23% of world market share. Samsung also is the leading company in OLED (organic light emitting diode) process technology and display panel which is more than 90% of world market share.(2)Intel: is the world leading company in personal computer CPU which has more than 90% market share of personal computer CPU (Central Process Unit) for many years. Intel is actually a world leading semiconductor IC technology in DRAM (many years ago) and Flash (at the present time) memory.(3)TSMC: TSMC is brief of Taiwan Semiconductor Manufacturing Company which is the world leading semiconductor foundry company has more than 50% market share. The author worked there for a few years as an R & D manager many years ago.(4)Micron: a world leading in DRAM and Flash memory IC.
Handbook Of Advanced Plasma Processing Techniques
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Author : R.J. Shul
language : en
Publisher: Springer Science & Business Media
Release Date : 2011-06-28
Handbook Of Advanced Plasma Processing Techniques written by R.J. Shul and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-06-28 with Technology & Engineering categories.
Pattern transfer by dry etching and plasma-enhanced chemical vapor de position are two of the cornerstone techniques for modern integrated cir cuit fabrication. The success of these methods has also sparked interest in their application to other techniques, such as surface-micromachined sen sors, read/write heads for data storage and magnetic random access memory (MRAM). The extremely complex chemistry and physics of plasmas and their interactions with the exposed surfaces of semiconductors and other materi als is often overlooked at the manufacturing stage. In this case, the process is optimized by an informed "trial-and-error" approach which relies heavily on design-of-experiment techniques and the intuition of the process engineer. The need for regular cleaning of plasma reactors to remove built-up reaction or precursor gas products adds an extra degree of complexity because the interaction of the reactive species in the plasma with the reactor walls can also have a strong effect on the number of these species available for etching or deposition. Since the microelectronics industry depends on having high process yields at each step of the fabrication process, it is imperative that a full understanding of plasma etching and deposition techniques be achieved.
Gan And Related Materials
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Author : Stephen J. Pearton
language : en
Publisher: CRC Press
Release Date : 2021-10-08
Gan And Related Materials written by Stephen J. Pearton and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-10-08 with Science categories.
Presents views on current developments in heat and mass transfer research related to the modern development of heat exchangers. Devotes special attention to the different modes of heat and mass transfer mechanisms in relation to the new development of heat exchangers design. Dedicates particular attention to the future needs and demands for further development in heat and mass transfer. GaN and related materials are attracting tremendous interest for their applications to high-density optical data storage, blue/green diode lasers and LEDs, high-temperature electronics for high-power microwave applications, electronics for aerospace and automobiles, and stable passivation films for semiconductors. In addition, there is great scientific interest in the nitrides, because they appear to form the first semiconductor system in which extended defects do not severely affect the optical properties of devices. This series provides a forum for the latest research in this rapidly-changing field, offering readers a basic understanding of new developments in recent research. Series volumes feature a balance between original theoretical and experimental research in basic physics, device physics, novel materials and quantum structures, processing, and systems.