Plasma Etching
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Plasma Processing
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Author : R. G. Frieser
language : en
Publisher:
Release Date : 1981
Plasma Processing written by R. G. Frieser and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1981 with Plasma engineering categories.
Plasma Etching And Reactive Ion Etching
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Author : J. W. Coburn
language : en
Publisher:
Release Date : 1982
Plasma Etching And Reactive Ion Etching written by J. W. Coburn and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1982 with Technology & Engineering categories.
Plasma Etching Processes For Sub Quarter Micron Devices
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Author : G. S. Mathad
language : en
Publisher: The Electrochemical Society
Release Date : 2000
Plasma Etching Processes For Sub Quarter Micron Devices written by G. S. Mathad and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000 with Integrated circuits categories.
Plasma Etching
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Author : M. Sugawara
language : en
Publisher: OUP Oxford
Release Date : 1998-05-28
Plasma Etching written by M. Sugawara and has been published by OUP Oxford this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998-05-28 with Technology & Engineering categories.
The focus of this book is the remarkable advances in understanding of low pressure RF (radio frequency) glow discharges. A basic analytical theory and plasma physics are explained. Plasma diagnostics are also covered before the practicalities of etcher use are explored.
Plasma Etching Processes For Cmos Devices Realization
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Author : Nicolas Posseme
language : en
Publisher: Elsevier
Release Date : 2017-01-25
Plasma Etching Processes For Cmos Devices Realization written by Nicolas Posseme and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-01-25 with Technology & Engineering categories.
Plasma etching has long enabled the perpetuation of Moore's Law. Today, etch compensation helps to create devices that are smaller than 20 nm. But, with the constant downscaling in device dimensions and the emergence of complex 3D structures (like FinFet, Nanowire and stacked nanowire at longer term) and sub 20 nm devices, plasma etching requirements have become more and more stringent. Now more than ever, plasma etch technology is used to push the limits of semiconductor device fabrication into the nanoelectronics age. This will require improvement in plasma technology (plasma sources, chamber design, etc.), new chemistries (etch gases, flows, interactions with substrates, etc.) as well as a compatibility with new patterning techniques such as multiple patterning, EUV lithography, Direct Self Assembly, ebeam lithography or nanoimprint lithography. This book presents these etch challenges and associated solutions encountered throughout the years for transistor realization. Helps readers discover the master technology used to pattern complex structures involving various materials Explores the capabilities of cold plasmas to generate well controlled etched profiles and high etch selectivities between materials Teaches users how etch compensation helps to create devices that are smaller than 20 nm
Plasma Etching Processes For Interconnect Realization In Vlsi
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Author : Nicolas Posseme
language : en
Publisher: Elsevier
Release Date : 2015-04-14
Plasma Etching Processes For Interconnect Realization In Vlsi written by Nicolas Posseme and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015-04-14 with Technology & Engineering categories.
This is the first of two books presenting the challenges and future prospects of plasma etching processes for microelectronics, reviewing the past, present and future issues of etching processes in order to improve the understanding of these issues through innovative solutions.This book focuses on back end of line (BEOL) for high performance device realization and presents an overview of all etch challenges for interconnect realization as well as the current etch solutions proposed in the semiconductor industry. The choice of copper/low-k interconnect architecture is one of the keys for integrated circuit performance, process manufacturability and scalability. Today, implementation of porous low-k material is mandatory in order to minimize signal propagation delay in interconnections. In this context, the traditional plasma process issues (plasma-induced damage, dimension and profile control, selectivity) and new emerging challenges (residue formation, dielectric wiggling) are critical points of research in order to control the reliability and reduce defects in interconnects. These issues and potential solutions are illustrated by the authors through different process architectures available in the semiconductor industry (metallic or organic hard mask strategies). Presents the difficulties encountered for interconnect realization in very large-scale integrated (VLSI) circuits Focused on plasma-dielectric surface interaction Helps you further reduce the dielectric constant for the future technological nodes
Glow Discharge Processes
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Author : Brian Chapman
language : en
Publisher: Wiley-Interscience
Release Date : 1980
Glow Discharge Processes written by Brian Chapman and has been published by Wiley-Interscience this book supported file pdf, txt, epub, kindle and other format this book has been release on 1980 with Science categories.
Develops detailed understanding of the deposition and etching of materials by sputtering discharge, and of etching of materials by chemically active discharge. Treats glow discharge at several levels from basic phenomena to industrial applications--practical techniques diligently related to fundamentals. Subjects range from voltage, distributions encountered in plasma etching systems to plasma-electron interactions that contribute to sustaining the discharge.
Dry Etching For Microelectronics
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Author : R.A. Powell
language : en
Publisher: Elsevier
Release Date : 2012-12-02
Dry Etching For Microelectronics written by R.A. Powell and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-02 with Technology & Engineering categories.
This volume collects together for the first time a series of in-depth, critical reviews of important topics in dry etching, such as dry processing of III-V compound semiconductors, dry etching of refractory metal silicides and dry etching aluminium and aluminium alloys. This topical format provides the reader with more specialised information and references than found in a general review article. In addition, it presents a broad perspective which would otherwise have to be gained by reading a large number of individual research papers. An additional important and unique feature of this book is the inclusion of an extensive literature review of dry processing, compiled by search of computerized data bases. A subject index allows ready access to the key points raised in each of the chapters.
Plasma Deposition Treatment And Etching Of Polymers
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Author : Riccardo d'Agostino
language : en
Publisher: Elsevier
Release Date : 2012-12-02
Plasma Deposition Treatment And Etching Of Polymers written by Riccardo d'Agostino and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-02 with Technology & Engineering categories.
Plasma Deposition, Treatment, and Etching of Polymers takes a broad look at the basic principles, the chemical processes, and the diagnostic procedures in the interaction of plasmas with polymer surfaces. This recent technology has yielded a large class of new materials offering many applications, including their use as coatings for chemical fibers and films. Additional applications include uses for the passivation of metals, the surface hardening of tools, increased biocompatibility of biomedical materials, chemical and physical sensors, and a variety of micro- and optoelectronic devices. Appeals to a broad range of industries from microelectronics to space technology Discusses a wide array of new uses for plasma polymers Provides a tutorial introduction to the field Surveys various classes of plasma polymers, their chemical and morphological properties, effects of plasma process parameters on the growth and structure of these synthetic materials, and techniques for characterization Interests scientists, engineers, and students alike
Plasma Etching In Semiconductor Fabrication
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Author : Russ A. Morgan
language : en
Publisher: North-Holland
Release Date : 1985-01-01
Plasma Etching In Semiconductor Fabrication written by Russ A. Morgan and has been published by North-Holland this book supported file pdf, txt, epub, kindle and other format this book has been release on 1985-01-01 with Science categories.
Hardbound. This book is based on a post-graduate study carried out by the author on plasma etching mechanisms of semiconductor materials such as silicon, silicon dioxide, photoresist and aluminium films used in integrated circuit fabrication. In this book he gives an extensive review of the chemistry of dry etching, sustaining mechanisms and reactor architecture. He also describes a study made on the measurement of the electrical characteristics and ionization conditions existing in a planar reactor. In addition, practical problems such as photoresist mask erosion have been investigated and the reader will find the photoresist chemistry very useful. The book contains a great deal of practical information on plasma etching processes. The electronics industry is continually seeking ways to improve the miniaturization of devices, and this account of the author's findings should be a useful contribution to the work of miniaturization.