Plasma Etching In Semiconductor Fabrication

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Plasma Etching In Semiconductor Fabrication

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Author : Russ A. Morgan
language : en
Publisher: North-Holland
Release Date : 1985-01-01

Plasma Etching In Semiconductor Fabrication written by Russ A. Morgan and has been published by North-Holland this book supported file pdf, txt, epub, kindle and other format this book has been release on 1985-01-01 with Science categories.

Hardbound. This book is based on a post-graduate study carried out by the author on plasma etching mechanisms of semiconductor materials such as silicon, silicon dioxide, photoresist and aluminium films used in integrated circuit fabrication. In this book he gives an extensive review of the chemistry of dry etching, sustaining mechanisms and reactor architecture. He also describes a study made on the measurement of the electrical characteristics and ionization conditions existing in a planar reactor. In addition, practical problems such as photoresist mask erosion have been investigated and the reader will find the photoresist chemistry very useful. The book contains a great deal of practical information on plasma etching processes. The electronics industry is continually seeking ways to improve the miniaturization of devices, and this account of the author's findings should be a useful contribution to the work of miniaturization.

Plasma Processes For Semiconductor Fabrication

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Author : W. N. G. Hitchon
language : en
Publisher: Cambridge University Press
Release Date : 1999-01-28

Plasma Processes For Semiconductor Fabrication written by W. N. G. Hitchon and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 1999-01-28 with Technology & Engineering categories.

Plasma processing is a central technique in the fabrication of semiconductor devices. This self-contained book provides an up-to-date description of plasma etching and deposition in semiconductor fabrication. It presents the basic physics and chemistry of these processes, and shows how they can be accurately modeled. The author begins with an overview of plasma reactors and discusses the various models for understanding plasma processes. He then covers plasma chemistry, addressing the effects of different chemicals on the features being etched. Having presented the relevant background material, he then describes in detail the modeling of complex plasma systems, with reference to experimental results. The book closes with a useful glossary of technical terms. No prior knowledge of plasma physics is assumed in the book. It contains many homework exercises and serves as an ideal introduction to plasma processing and technology for graduate students of electrical engineering and materials science. It will also be a useful reference for practicing engineers in the semiconductor industry.

Dry Etching For Microelectronics

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Author : R.A. Powell
language : en
Publisher: Elsevier
Release Date : 2012-12-02

Dry Etching For Microelectronics written by R.A. Powell and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-02 with Technology & Engineering categories.

This volume collects together for the first time a series of in-depth, critical reviews of important topics in dry etching, such as dry processing of III-V compound semiconductors, dry etching of refractory metal silicides and dry etching aluminium and aluminium alloys. This topical format provides the reader with more specialised information and references than found in a general review article. In addition, it presents a broad perspective which would otherwise have to be gained by reading a large number of individual research papers. An additional important and unique feature of this book is the inclusion of an extensive literature review of dry processing, compiled by search of computerized data bases. A subject index allows ready access to the key points raised in each of the chapters.

Plasma Processing Of Semiconductors

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Author : P.F. Williams
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-11-11

Plasma Processing Of Semiconductors written by P.F. Williams and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-11-11 with Technology & Engineering categories.

Plasma Processing of Semiconductors contains 28 contributions from 18 experts and covers plasma etching, plasma deposition, plasma-surface interactions, numerical modelling, plasma diagnostics, less conventional processing applications of plasmas, and industrial applications. Audience: Coverage ranges from introductory to state of the art, thus the book is suitable for graduate-level students seeking an introduction to the field as well as established workers wishing to broaden or update their knowledge.

Plasma Etching Processes For Sub Quarter Micron Devices

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Author : G. S. Mathad
language : en
Publisher: The Electrochemical Society
Release Date : 2000

Plasma Etching Processes For Sub Quarter Micron Devices written by G. S. Mathad and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000 with Integrated circuits categories.

Semiconductor Ic Plasma Dry Etching Process

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Author : Kung Linliu
language : en
Publisher: Independently Published
Release Date : 2020-02-11

Semiconductor Ic Plasma Dry Etching Process written by Kung Linliu and has been published by Independently Published this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-02-11 with categories.

Semiconductor market value of 2018 was around 468.8 billion US dollars. It is increased for about 13.7% than year 2017. For 2019, it is estimated decrease about 10% to 13% which is 422 to 408 billion US dollars.This market is in a way winner takes all, for example, TSMC (Taiwan Semiconductor Manufacturing Company) which is the world leading semiconductor foundry company has more than 50% market share. Intel has more than 90% market share of personal computer CPU (Central Process Unit) for many years. However, the semiconductor IC process technology sometimes might change the rule of market. Just recently, AMD (Advanced Micro Devices, Inc.) has more than 17% market share of personal computer CPU because they use foundry of TSMC with 7nm EUV technology node (Extreme Ultraviolet, its wavelength is 13.5 nm, shorter wavelength has better critical dimension (CD) resolution for IC process).For the present time, there are four leading semiconductor companies in the world with EUV technology process node which are as follows: (1)Samsung: the world leading semiconductor IC process company for commodity IC such as DRAM、Flash memory and IC for cell phone. The world leading company in cell phone market share, Samsung has highest volume unit of mobile phone which is 75.1 million unit representing 23% of world market share. Samsung also is the leading company in OLED (organic light emitting diode) process technology and display panel which is more than 90% of world market share.(2)Intel: is the world leading company in personal computer CPU which has more than 90% market share of personal computer CPU (Central Process Unit) for many years. Intel is actually a world leading semiconductor IC technology in DRAM (many years ago) and Flash (at the present time) memory.(3)TSMC: TSMC is brief of Taiwan Semiconductor Manufacturing Company which is the world leading semiconductor foundry company has more than 50% market share. The author worked there for a few years as an R & D manager many years ago.(4)Micron: a world leading in DRAM and Flash memory IC.

Atomic Layer Processing

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Author : Thorsten Lill
language : en
Publisher: John Wiley & Sons
Release Date : 2021-06-28

Atomic Layer Processing written by Thorsten Lill and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2021-06-28 with Technology & Engineering categories.

Learn about fundamental and advanced topics in etching with this practical guide Atomic Layer Processing: Semiconductor Dry Etching Technology delivers a hands-on, one-stop resource for understanding etching technologies and their applications. The distinguished scientist, executive, and author offers readers in-depth information on the various etching technologies used in the semiconductor industry, including thermal, isotropic atomic layer, radical, ion-assisted, and reactive ion etching. The book begins with a brief history of etching technology and the role it has played in the information technology revolution, along with a collection of commonly used terminology in the industry. It then moves on to discuss a variety of different etching techniques, before concluding with discussions of the fundamentals of etching reactor design and newly emerging topics in the field such as the role played by artificial intelligence in the technology. Atomic Layer Processing includes a wide variety of other topics as well, all of which contribute to the author's goal of providing the reader with an atomic-level understanding of dry etching technology sufficient to develop specific solutions for existing and emerging semiconductor technologies. Readers will benefit from: A complete discussion of the fundamentals of how to remove atoms from various surfaces An examination of emerging etching technologies, including laser and electron beam assisted etching A treatment of process control in etching technology and the role played by artificial intelligence Analyses of a wide variety of etching methods, including thermal or vapor etching, isotropic atomic layer etching, radical etching, directional atomic layer etching, and more Perfect for materials scientists, semiconductor physicists, and surface chemists, Atomic Layer Processing will also earn a place in the libraries of engineering scientists in industry and academia, as well as anyone involved with the manufacture of semiconductor technology. The author's close involvement with corporate research & development and academic research allows the book to offer a uniquely multifaceted approach to the subject.

Dry Etching Technology For Semiconductors

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Author : Kazuo Nojiri
language : en
Publisher: Springer
Release Date : 2014-10-25

Dry Etching Technology For Semiconductors written by Kazuo Nojiri and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-10-25 with Technology & Engineering categories.

This book is a must-have reference to dry etching technology for semiconductors, which will enable engineers to develop new etching processes for further miniaturization and integration of semiconductor integrated circuits. The author describes the device manufacturing flow, and explains in which part of the flow dry etching is actually used. The content is designed as a practical guide for engineers working at chip makers, equipment suppliers and materials suppliers, and university students studying plasma, focusing on the topics they need most, such as detailed etching processes for each material (Si, SiO2, Metal etc) used in semiconductor devices, etching equipment used in manufacturing fabs, explanation of why a particular plasma source and gas chemistry are used for the etching of each material, and how to develop etching processes. The latest, key technologies are also described, such as 3D IC Etching, Dual Damascene Etching, Low-k Etching, Hi-k/Metal Gate Etching, FinFET Etching, Double Patterning etc.

Applications Of Plasma Processes To Vlsi Technology

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Author : Takuo Sugano
language : en
Publisher: Wiley-Interscience
Release Date : 1985-09-24

Applications Of Plasma Processes To Vlsi Technology written by Takuo Sugano and has been published by Wiley-Interscience this book supported file pdf, txt, epub, kindle and other format this book has been release on 1985-09-24 with Science categories.

Presents state-of-the-art research in microelectronic processing for very large scale integration. Emphasizing applications and techniques, this book provides considerable insight into Japan's technological effort in this important area of science. Focuses on research involving plasma deposition and dry etching. Considerable attention is devoted to MOS gate fabrication, the studies of the influence of process parameters on electrical properties, dry processing technologies, and the theory of plasma chemical reactions.

Plasma Etching Processes For Cmos Devices Realization

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Author : Nicolas Posseme
language : en
Publisher: Elsevier
Release Date : 2017-01-25

Plasma Etching Processes For Cmos Devices Realization written by Nicolas Posseme and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-01-25 with Technology & Engineering categories.

Plasma etching has long enabled the perpetuation of Moore's Law. Today, etch compensation helps to create devices that are smaller than 20 nm. But, with the constant downscaling in device dimensions and the emergence of complex 3D structures (like FinFet, Nanowire and stacked nanowire at longer term) and sub 20 nm devices, plasma etching requirements have become more and more stringent. Now more than ever, plasma etch technology is used to push the limits of semiconductor device fabrication into the nanoelectronics age. This will require improvement in plasma technology (plasma sources, chamber design, etc.), new chemistries (etch gases, flows, interactions with substrates, etc.) as well as a compatibility with new patterning techniques such as multiple patterning, EUV lithography, Direct Self Assembly, ebeam lithography or nanoimprint lithography. This book presents these etch challenges and associated solutions encountered throughout the years for transistor realization. Helps readers discover the master technology used to pattern complex structures involving various materials Explores the capabilities of cold plasmas to generate well controlled etched profiles and high etch selectivities between materials Teaches users how etch compensation helps to create devices that are smaller than 20 nm