Interconnection Noise In Vlsi Circuits
DOWNLOAD
Download Interconnection Noise In Vlsi Circuits PDF/ePub or read online books in Mobi eBooks. Click Download or Read Online button to get Interconnection Noise In Vlsi Circuits book now. This website allows unlimited access to, at the time of writing, more than 1.5 million titles, including hundreds of thousands of titles in various foreign languages. If the content not found or just blank you must refresh this page
Interconnection Noise In Vlsi Circuits
DOWNLOAD
Author : Francesc Moll
language : en
Publisher: Springer Science & Business Media
Release Date : 2004
Interconnection Noise In Vlsi Circuits written by Francesc Moll and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2004 with Language Arts & Disciplines categories.
Later, simple models of crosstalk and switching noise are used to give an intuitive understanding of these problems. Finally, some verification and test issues related to interconnection noise are discussed. Throughout the book, the examples used to illustrate the discussion are based on digital CMOS circuits, but the general treatment of the problems is from a fundamental point of view, so that the discussion can be applied to different technologies.
Interconnect Noise Optimization In Nanometer Technologies
DOWNLOAD
Author : Mohamed Elgamel
language : en
Publisher: Springer Science & Business Media
Release Date : 2006-03-20
Interconnect Noise Optimization In Nanometer Technologies written by Mohamed Elgamel and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-03-20 with Technology & Engineering categories.
Interconnect has become the dominating factor in determining system performance in nanometer technologies. Dedicated to this subject, Interconnect Noise Optimization in Nanometer Technologies provides insight and intuition into layout analysis and optimization for interconnect in high speed, high complexity integrated circuits. The authors bring together a wealth of information presenting a range of CAD algorithms and techniques for synthesizing and optimizing interconnect. Practical aspects of the algorithms and the models are explained with sufficient details. The book investigates the most effective parameters in layout optimization. Different post-layout optimization techniques with complexity analysis and benchmarks tests are provided. The impact crosstalk noise and coupling on the wire delay is analyzed. Parameters that affect signal integrity are also considered.
Interconnects In Vlsi Design
DOWNLOAD
Author : Hartmut Grabinski
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Interconnects In Vlsi Design written by Hartmut Grabinski and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999. This publication addresses the need of developers and researchers in the field of VLSI chip and package design. It offers a survey of current problems regarding the influence of interconnect effects on the electrical performance of electronic circuits and suggests innovative solutions. In this sense the present book represents a continua tion and a supplement to the first book "Signal Propagation on Interconnects", Kluwer Academic Publishers, 1998. The papers in this book cover a wide area of research directions: Beneath the des cription of general trends they deal with the solution of signal integrity problems, the modeling of interconnects, parameter extraction using calculations and measurements and last but not least actual problems in the field of optical interconnects.
Compact Models And Performance Investigations For Subthreshold Interconnects
DOWNLOAD
Author : Rohit Dhiman
language : en
Publisher: Springer
Release Date : 2014-11-07
Compact Models And Performance Investigations For Subthreshold Interconnects written by Rohit Dhiman and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-11-07 with Technology & Engineering categories.
The book provides a detailed analysis of issues related to sub-threshold interconnect performance from the perspective of analytical approach and design techniques. Particular emphasis is laid on the performance analysis of coupling noise and variability issues in sub-threshold domain to develop efficient compact models. The proposed analytical approach gives physical insight of the parameters affecting the transient behavior of coupled interconnects. Remedial design techniques are also suggested to mitigate the effect of coupling noise. The effects of wire width, spacing between the wires, wire length are thoroughly investigated. In addition, the effect of parameters like driver strength on peak coupling noise has also been analyzed. Process, voltage and temperature variations are prominent factors affecting sub-threshold design and have also been investigated. The process variability analysis has been carried out using parametric analysis, process corner analysis and Monte Carlo technique. The book also provides a qualitative summary of the work reported in the literature by various researchers in the design of digital sub-threshold circuits. This book should be of interest for researchers and graduate students with deeper insights into sub-threshold interconnect models in particular. In this sense, this book will best fit as a text book and/or a reference book for students who are initiated in the area of research and advanced courses in nanotechnology, interconnect design and modeling.
Nano Interconnect Materials And Models For Next Generation Integrated Circuit Design
DOWNLOAD
Author : Sandip Bhattacharya
language : en
Publisher: CRC Press
Release Date : 2023-12-22
Nano Interconnect Materials And Models For Next Generation Integrated Circuit Design written by Sandip Bhattacharya and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2023-12-22 with Technology & Engineering categories.
Aggressive scaling of device and interconnect dimensions has resulted in many low-dimensional issues in the nanometer regime. This book deals with various new-generation interconnect materials and interconnect modeling, and highlights the significance of novel nano-interconnect materials for 3D integrated circuit design. It provides information about advanced nanomaterials like carbon nanotube (CNT) and graphene nanoribbon (GNR) for the realization of interconnects, interconnect models, and crosstalk noise analysis. Features: • Focuses on materials and nanomaterials utilization in next-generation interconnects based on carbon nanotubes (CNT) and graphene nanoribbons (GNR). • Helps readers realize interconnects, interconnect models, and crosstalk noise analysis. • Describes hybrid CNT- and GNR-based interconnects. • Presents the details of power supply voltage drop analysis in CNT and GNR interconnects. • Overviews pertinent RF performance and stability analysis. This book is aimed at graduate students and researchers in electrical and materials engineering, and nano-/microelectronics.
Test Generation Of Crosstalk Delay Faults In Vlsi Circuits
DOWNLOAD
Author : S. Jayanthy
language : en
Publisher: Springer
Release Date : 2018-09-20
Test Generation Of Crosstalk Delay Faults In Vlsi Circuits written by S. Jayanthy and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-09-20 with Technology & Engineering categories.
This book describes a variety of test generation algorithms for testing crosstalk delay faults in VLSI circuits. It introduces readers to the various crosstalk effects and describes both deterministic and simulation-based methods for testing crosstalk delay faults. The book begins with a focus on currently available crosstalk delay models, test generation algorithms for delay faults and crosstalk delay faults, before moving on to deterministic algorithms and simulation-based algorithms used to test crosstalk delay faults. Given its depth of coverage, the book will be of interest to design engineers and researchers in the field of VLSI Testing.
Circuits Interconnections And Packaging For Vlsi
DOWNLOAD
Author : H. B. Bakoglu
language : en
Publisher: Addison Wesley Publishing Company
Release Date : 1990
Circuits Interconnections And Packaging For Vlsi written by H. B. Bakoglu and has been published by Addison Wesley Publishing Company this book supported file pdf, txt, epub, kindle and other format this book has been release on 1990 with Computers categories.
High Speed Interconnects In Vlsi Design Modeling And Signal Integrity
DOWNLOAD
Author : Dr. Bhaskar Gugulothu
language : en
Publisher: AQUA PUBLICATIONS
Release Date :
High Speed Interconnects In Vlsi Design Modeling And Signal Integrity written by Dr. Bhaskar Gugulothu and has been published by AQUA PUBLICATIONS this book supported file pdf, txt, epub, kindle and other format this book has been release on with Computers categories.
The rapid advancement in VLSI (Very-Large-Scale Integration) technology has ushered in a new era of high-performance systems, where interconnects have become a critical bottleneck in determining speed, power, and reliability. This textbook provides a comprehensive understanding of high-speed interconnect design, analytical and simulation-based modeling techniques, and signal integrity challenges in modern integrated circuits. It is intended for graduate students, researchers, and industry professionals involved in IC design and signal integrity analysis.
Vlsi Soc Technologies For Systems Integration
DOWNLOAD
Author : Jürgen Becker
language : en
Publisher: Springer
Release Date : 2011-08-22
Vlsi Soc Technologies For Systems Integration written by Jürgen Becker and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2011-08-22 with Computers categories.
This book contains extended and revised versions of the best papers presented at the 17th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2009, held in Florianópolis, Brazil, in October 2009. The 8 papers included in the book together with two keynote talks were carefully reviewed and selected from 27 papers presented at the conference. The papers cover a wide variety of excellence in VLSI technology and advanced research addressing the current trend toward increasing chip integration and technology process advancements bringing about stimulating new challenges both at the physical and system-design levels, as well as in the test of theses systems.
Copper Interconnect Technology
DOWNLOAD
Author : Tapan Gupta
language : en
Publisher: Springer Science & Business Media
Release Date : 2010-01-22
Copper Interconnect Technology written by Tapan Gupta and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-01-22 with Technology & Engineering categories.
Since overall circuit performance has depended primarily on transistor properties, previous efforts to enhance circuit and system speed were focused on transistors as well. During the last decade, however, the parasitic resistance, capacitance, and inductance associated with interconnections began to influence circuit performance and will be the primary factors in the evolution of nanoscale ULSI technology. Because metallic conductivity and resistance to electromigration of bulk copper (Cu) are better than aluminum, use of copper and low-k materials is now prevalent in the international microelectronics industry. As the feature size of the Cu-lines forming interconnects is scaled, resistivity of the lines increases. At the same time electromigration and stress-induced voids due to increased current density become significant reliability issues. Although copper/low-k technology has become fairly mature, there is no single book available on the promise and challenges of these next-generation technologies. In this book, a leader in the field describes advanced laser systems with lower radiation wavelengths, photolithography materials, and mathematical modeling approaches to address the challenges of Cu-interconnect technology.