Microelectronic Interconnects And Packages System And Process Integration
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Microelectronic Interconnects And Packages System And Process Integration
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Author : Stuart K. Tewksbury
language : en
Publisher:
Release Date : 1991
Microelectronic Interconnects And Packages System And Process Integration written by Stuart K. Tewksbury and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1991 with Interconnects (Integrated circuit technology) categories.
International Symposium On Advances In Interconnection And Packaging 5 9 November 1990 Boston Massachusetts Book 2 Microelectronic Interconnects And
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Author : Alfred P. DeFonzo
language : en
Publisher:
Release Date : 1991-04
International Symposium On Advances In Interconnection And Packaging 5 9 November 1990 Boston Massachusetts Book 2 Microelectronic Interconnects And written by Alfred P. DeFonzo and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1991-04 with Technology & Engineering categories.
Quality Conformance And Qualification Of Microelectronic Packages And Interconnects
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Author : Michael Pecht
language : en
Publisher: John Wiley & Sons
Release Date : 1994-12-13
Quality Conformance And Qualification Of Microelectronic Packages And Interconnects written by Michael Pecht and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994-12-13 with Technology & Engineering categories.
All packaging engineers and technologists who want to ensure thatthey give their customers the highest quality, most cost-effectiveproducts should know that the paradigm has shifted. It has shiftedaway from the MIL-STDs and other government standards and testprocedures that don't cost-effectively address potential failuremechanisms or the manufacturing processes of the product. It hasshifted decisively towards tackling the root causes of failure andthe appropriate implementation of cost-effective process controls,qualityscreens, and tests. This book's groundbreaking, science-based approach to developingqualification and quality assurance programs helps engineers reacha new level of reliability in today's high-performancemicroelectronics. It does this with powerful... * Techniques for identifying and modeling failure mechanismsearlier in the design cycle, breaking the need to rely on fielddata * Physics-of-failure product reliability assessment methods thatcan be proactively implemented throughout the design andmanufacture of the product * Process controls that decrease variabilities in the end productand reduce end-of-line screening and testing A wide range of microelectronic package and interconnectconfigurations for both single-and multi-chip modules is examined,including chip and wire-bonds, tape-automated (TAB), flip-TAB,flip-chip bonds, high-density interconnects, chip-on-board designs(COB), MCM, 3-D stack, and many more. The remaining packageelements, such as die attachment, case and lid, leads, and lid andlead seals are also discussed in detail. The product of a distinguished team of authors and editors, thisbook's guidelines for avoiding potential high-risk manufacturingand qualification problems, as well as for implementing ongoingquality assurance, are sure to prove invaluable to both studentsand practicing professionals. For the professional engineer involved in the design andmanufacture of products containing electronic components, here is acomprehensive handbook to the theory and methods surrounding theassembly of microelectronic and electronic components. The bookfocuses on computers and consumer electronic products with internalsubsystems that reflect mechanical design constraints, costlimitations, and aesthetic and ergonomic concerns. Taking a totalsystem approach to packaging, the book systematically examines:basic chip and computer architecture; design and layout;interassembly and interconnections; cooling scheme; materialsselection, including ceramics, glasses, and metals; stress,vibration, and acoustics; and manufacturing and assemblytechnology. 1994 (0-471-53299-1) 800 pp. INTEGRATED CIRCUIT, HYBRID, AND MULTICHIP MODULE PACKAGE DESIGNGUIDELINES: A Focus on Reliability --Michael Pecht This comprehensive guide features a uniquely organized time-phasedapproach to design, development, qualification, manufacture, andin-service management. It provides step-by-step instructions on howto define realistic system requirements, define the system usageenvironment, identify potential failure modes, characterizematerials and processes by the key control label factors, and useexperiment, step-stress, and accelerated methods to ensure optimumdesign before production begins. Topics covered include: detaileddesign guidelines for substrate...wire and wire, tape automated,and flip-chip bonding...element attachment and case, lead, lead andlid seals--incorporating dimensional and geometric configurationsof package elements, manufacturing and assembly conditions,materials selection, and loading conditions. 1993 (0-471-59446-6)454 pp.
Parallel And Distributed Processing
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Author : Jose Rolim
language : en
Publisher: Springer
Release Date : 2003-06-26
Parallel And Distributed Processing written by Jose Rolim and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003-06-26 with Computers categories.
This volume contains the proceedings from the workshops held in conjunction with the IEEE International Parallel and Distributed Processing Symposium, IPDPS 2000, on 1-5 May 2000 in Cancun, Mexico. The workshopsprovidea forum for bringing together researchers,practiti- ers, and designers from various backgrounds to discuss the state of the art in parallelism.Theyfocusondi erentaspectsofparallelism,fromruntimesystems to formal methods, from optics to irregular problems, from biology to networks of personal computers, from embedded systems to programming environments; the following workshops are represented in this volume: { Workshop on Personal Computer Based Networks of Workstations { Workshop on Advances in Parallel and Distributed Computational Models { Workshop on Par. and Dist. Comp. in Image, Video, and Multimedia { Workshop on High-Level Parallel Prog. Models and Supportive Env. { Workshop on High Performance Data Mining { Workshop on Solving Irregularly Structured Problems in Parallel { Workshop on Java for Parallel and Distributed Computing { WorkshoponBiologicallyInspiredSolutionsto ParallelProcessingProblems { Workshop on Parallel and Distributed Real-Time Systems { Workshop on Embedded HPC Systems and Applications { Recon gurable Architectures Workshop { Workshop on Formal Methods for Parallel Programming { Workshop on Optics and Computer Science { Workshop on Run-Time Systems for Parallel Programming { Workshop on Fault-Tolerant Parallel and Distributed Systems All papers published in the workshops proceedings were selected by the p- gram committee on the basis of referee reports. Each paper was reviewed by independent referees who judged the papers for originality, quality, and cons- tency with the themes of the workshops.
Interconnect Technology And Design For Gigascale Integration
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Author : Jeffrey A. Davis
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Interconnect Technology And Design For Gigascale Integration written by Jeffrey A. Davis and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Technology & Engineering categories.
This book is jointly authored by leading academic and industry researchers. The material is unique in that it spans IC interconnect topics ranging from IBM's revolutionary copper process to an in-depth exploration into interconnect-aware computer architectures.
International Symposium On Advances In Interconnection And Packaging
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Author :
language : en
Publisher:
Release Date : 1991
International Symposium On Advances In Interconnection And Packaging written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1991 with Microelectronic packaging categories.
Integrated Circuit Packaging Assembly And Interconnections
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Author : William Greig
language : en
Publisher: Springer Science & Business Media
Release Date : 2007-04-24
Integrated Circuit Packaging Assembly And Interconnections written by William Greig and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007-04-24 with Technology & Engineering categories.
Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that encompass electronic manufacturing. It covers both the technical issues and touches on some of the reliability concerns with the various technologies applicable to packaging and assembly of the IC. The book discusses the various packaging approaches, assembly options, and essential manufacturing technologies, among other relevant topics.
Polyimides
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Author : Malay Ghosh
language : en
Publisher: CRC Press
Release Date : 2018-02-06
Polyimides written by Malay Ghosh and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2018-02-06 with Technology & Engineering categories.
Provides coverage on the full range of topics associated with polyimides, including structure, polymer fundamentals, and product areas. The text addresses both basic and applied aspects of the subject. It details the synthesis of polyimides, polyamideimides, and flourinated polyimides, explains the molecular design of photosensitive polyimides, and more.
Directory Of Published Proceedings
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Author :
language : en
Publisher:
Release Date : 1996
Directory Of Published Proceedings written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996 with Engineering categories.
Introduction To Microsystem Packaging Technology
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Author : Yufeng Jin
language : en
Publisher: CRC Press
Release Date : 2017-12-19
Introduction To Microsystem Packaging Technology written by Yufeng Jin and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-19 with Technology & Engineering categories.
The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.