Silicon Devices And Process Integration
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Silicon Devices And Process Integration
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Author : Badih El-Kareh
language : en
Publisher: Springer Science & Business Media
Release Date : 2009-01-09
Silicon Devices And Process Integration written by Badih El-Kareh and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-01-09 with Technology & Engineering categories.
Silicon Devices and Process Integration covers state-of-the-art silicon devices, their characteristics, and their interactions with process parameters. It serves as a comprehensive guide which addresses both the theoretical and practical aspects of modern silicon devices and the relationship between their electrical properties and processing conditions. The book is compiled from the author’s industrial and academic lecture notes and reflects years of experience in the development of silicon devices. Features include: A review of silicon properties which provides a foundation for understanding the device properties discussion, including mobility-enhancement by straining silicon; State-of-the-art technologies on high-K gate dielectrics, low-K dielectrics, Cu interconnects, and SiGe BiCMOS; CMOS-only applications, such as subthreshold current and parasitic latch-up; Advanced Enabling processes and process integration. This book is written for engineers and scientists in semiconductor research, development and manufacturing. The problems at the end of each chapter and the numerous charts, figures and tables also make it appropriate for use as a text in graduate and advanced undergraduate courses in electrical engineering and materials science.
Silicon Analog Components
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Author : Badih El-Kareh
language : en
Publisher: Springer
Release Date : 2019-08-07
Silicon Analog Components written by Badih El-Kareh and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2019-08-07 with Technology & Engineering categories.
This book covers modern analog components, their characteristics, and interactions with process parameters. It serves as a comprehensive guide, addressing both the theoretical and practical aspects of modern silicon devices and the relationship between their electrical properties and processing conditions. Based on the authors’ extensive experience in the development of analog devices, this book is intended for engineers and scientists in semiconductor research, development and manufacturing. The problems at the end of each chapter and the numerous charts, figures and tables also make it appropriate for use as a text in graduate and advanced undergraduate courses in electrical engineering and materials science. Enables engineers to understand analog device physics, and discusses important relations between process integration, device design, component characteristics, and reliability; Describes in step-by-step fashion the components that are used in analog designs, the particular characteristics of analog components, while comparing them to digital applications; Explains the second-order effects in analog devices, and trade-offs between these effects when designing components and developing an integrated process for their manufacturing.
Ulsi Process Integration Iii
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Author : Electrochemical Society. Meeting
language : en
Publisher: The Electrochemical Society
Release Date : 2003
Ulsi Process Integration Iii written by Electrochemical Society. Meeting and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003 with Technology & Engineering categories.
Ulsi Process Integration 6
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Author : C. Claeys
language : en
Publisher: The Electrochemical Society
Release Date : 2009-09
Ulsi Process Integration 6 written by C. Claeys and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-09 with Science categories.
ULSI Process Integration 6 covers all aspects of process integration. Sections are devoted to 1) Device Technologies, 2) Front-end-of-line integration (gate stacks, shallow junctions, dry etching, etc.), 3) Back-end-of-line integration (CMP, low-k, Cu interconnect, air-gaps, 3D packaging, etc.), 4) Alternative channel technologies (Ge, III-V, hybrid integration), and 5) Emerging technologies (CNT, graphene, polymer electronics, nanotubes).
Power Microelectronics Device And Process Technologies Second Edition
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Author : Yung Chii Liang
language : en
Publisher: World Scientific
Release Date : 2017-03-14
Power Microelectronics Device And Process Technologies Second Edition written by Yung Chii Liang and has been published by World Scientific this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-03-14 with Technology & Engineering categories.
'This is an excellent reference book for graduates or undergraduates studying semiconductor technology, or for working professionals who need a reference for detailed theory and working knowledge of processes in the field of power semiconductor devices.'IEEE Electrical Insulation MagazineThis descriptive textbook provides a clear look at the theories and process technologies necessary for understanding the modern power semiconductor devices, i.e. from the fundamentals of p-n junction electrostatics, unipolar MOSFET and superjunction structures, bipolar IGBT, to the most recent wide bandgap SiC and GaN devices. It also covers their associated semiconductor process technologies. Real examples based on actual fabricated devices, with the process steps described in clear detail are especially useful. This book is suitable for university courses on power semiconductor or power electronic devices. Device designers and researchers will also find this book a good reference in their work, especially for those focusing on the advanced device development and design aspects.
Silicon Based Unified Memory Devices And Technology
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Author : Arup Bhattacharyya
language : en
Publisher: CRC Press
Release Date : 2017-07-06
Silicon Based Unified Memory Devices And Technology written by Arup Bhattacharyya and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-07-06 with Technology & Engineering categories.
The primary focus of this book is on basic device concepts, memory cell design, and process technology integration. The first part provides in-depth coverage of conventional nonvolatile memory devices, stack structures from device physics, historical perspectives, and identifies limitations of conventional devices. The second part reviews advances made in reducing and/or eliminating existing limitations of NVM device parameters from the standpoint of device scalability, application extendibility, and reliability. The final part proposes multiple options of silicon based unified (nonvolatile) memory cell concepts and stack designs (SUMs). The book provides Industrial R&D personnel with the knowledge to drive the future memory technology with the established silicon FET-based establishments of their own. It explores application potentials of memory in areas such as robotics, avionics, health-industry, space vehicles, space sciences, bio-imaging, genetics etc.
Sige Ge And Related Compounds 6 Materials Processing And Devices
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Author : D. Harame
language : en
Publisher: The Electrochemical Society
Release Date :
Sige Ge And Related Compounds 6 Materials Processing And Devices written by D. Harame and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on with categories.
Silicon Photonics Iii
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Author : Lorenzo Pavesi
language : en
Publisher: Springer Science & Business Media
Release Date : 2016-01-08
Silicon Photonics Iii written by Lorenzo Pavesi and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-01-08 with Science categories.
This book is volume III of a series of books on silicon photonics. It reports on the development of fully integrated systems where many different photonics component are integrated together to build complex circuits. This is the demonstration of the fully potentiality of silicon photonics. It contains a number of chapters written by engineers and scientists of the main companies, research centers and universities active in the field. It can be of use for all those persons interested to know the potentialities and the recent applications of silicon photonics both in microelectronics, telecommunication and consumer electronics market.
Istfa 2017 Proceedings From The 43rd International Symposium For Testing And Failure Analysis
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Author : ASM International
language : en
Publisher: ASM International
Release Date : 2017-12-01
Istfa 2017 Proceedings From The 43rd International Symposium For Testing And Failure Analysis written by ASM International and has been published by ASM International this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-01 with Technology & Engineering categories.
The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.
Advanced Mos Device Physics
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Author : Norman Einspruch
language : en
Publisher: Elsevier
Release Date : 2012-12-02
Advanced Mos Device Physics written by Norman Einspruch and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-02 with Technology & Engineering categories.
VLSI Electronics Microstructure Science, Volume 18: Advanced MOS Device Physics explores several device physics topics related to metal oxide semiconductor (MOS) technology. The emphasis is on physical description, modeling, and technological implications rather than on the formal aspects of device theory. Special attention is paid to the reliability physics of small-geometry MOSFETs. Comprised of eight chapters, this volume begins with a general picture of MOS technology development from the device and processing points of view. The critical issue of hot-carrier effects is discussed, along with the device engineering aspects of this problem; the emerging low-temperature MOS technology; and the problem of latchup in scaled MOS circuits. Several device models that are suitable for use in circuit simulators are also described. The last chapter examines novel electron transport effects observed in ultra-small MOS structures. This book should prove useful to semiconductor engineers involved in different aspects of MOS technology development, as well as for researchers in this field and students of the corresponding disciplines.