Simulation And Compensation Methods For Euv Lithography Masks With Buried Defects
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Simulation And Compensation Methods For Euv Lithography Masks With Buried Defects
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Author : Chris Heinz Clifford
language : en
Publisher:
Release Date : 2010
Simulation And Compensation Methods For Euv Lithography Masks With Buried Defects written by Chris Heinz Clifford and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010 with categories.
Materials And Processes For Next Generation Lithography
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Author :
language : en
Publisher: Elsevier
Release Date : 2016-11-08
Materials And Processes For Next Generation Lithography written by and has been published by Elsevier this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-11-08 with Science categories.
As the requirements of the semiconductor industry have become more demanding in terms of resolution and speed it has been necessary to push photoresist materials far beyond the capabilities previously envisioned. Currently there is significant worldwide research effort in to so called Next Generation Lithography techniques such as EUV lithography and multibeam electron beam lithography. These developments in both the industrial and the academic lithography arenas have led to the proliferation of numerous novel approaches to resist chemistry and ingenious extensions of traditional photopolymers. Currently most texts in this area focus on either lithography with perhaps one or two chapters on resists, or on traditional resist materials with relatively little consideration of new approaches. This book therefore aims to bring together the worlds foremost resist development scientists from the various community to produce in one place a definitive description of the many approaches to lithography fabrication. - Assembles up-to-date information from the world's premier resist chemists and technique development lithographers on the properties and capabilities of the wide range of resist materials currently under investigation - Includes information on processing and metrology techniques - Brings together multiple approaches to litho pattern recording from academia and industry in one place
Emerging Lithographic Technologies
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Author :
language : en
Publisher:
Release Date : 2007
Emerging Lithographic Technologies written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007 with Lithography categories.
Annual Symposium On Photomask Technology
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Author :
language : en
Publisher:
Release Date : 1999
Annual Symposium On Photomask Technology written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1999 with Integrated circuits categories.
Design For Manufacturability Through Design Process Integration
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Author : Alfred Kwok-Kit Wong
language : en
Publisher: SPIE-International Society for Optical Engineering
Release Date : 2007
Design For Manufacturability Through Design Process Integration written by Alfred Kwok-Kit Wong and has been published by SPIE-International Society for Optical Engineering this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007 with Business & Economics categories.
Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.
Fast Simulation Methods For Non Planar Phase And Multilayer Defects In Duv And Euv Photomasks For Lithography
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Author : Michael Christopher Lam
language : en
Publisher:
Release Date : 2005
Fast Simulation Methods For Non Planar Phase And Multilayer Defects In Duv And Euv Photomasks For Lithography written by Michael Christopher Lam and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005 with categories.
Fast Simulation Of Buried Euv Mask Defect Interaction With Absorber Features
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Author : Chris Heinz Clifford
language : en
Publisher:
Release Date : 2007
Fast Simulation Of Buried Euv Mask Defect Interaction With Absorber Features written by Chris Heinz Clifford and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2007 with categories.
Evaluating Printability Of Buried Native Euv Mask Phase Defects Through A Modeling And Simulation Approach
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Author :
language : en
Publisher:
Release Date : 2015
Evaluating Printability Of Buried Native Euv Mask Phase Defects Through A Modeling And Simulation Approach written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2015 with categories.
The availability of defect-free masks is considered to be a critical issue for enabling extreme ultraviolet lithography (EUVL) as the next generation technology. Since completely defect-free masks will be hard to achieve, it is essential to have a good understanding of the printability of the native EUV mask defects. In this work, we performed a systematic study of native mask defects to understand the defect printability caused by them. The multilayer growth over native substrate mask blank defects was correlated to the multilayer growth over regular-shaped defects having similar profiles in terms of their width and height. To model the multilayer growth over the defects, a novel level-set multilayer growth model was used that took into account the tool deposition conditions of the Veeco Nexus ion beam deposition tool. The same tool was used for performing the actual deposition of the multilayer stack over the characterized native defects, thus ensuring a fair comparison between the actual multilayer growth over native defects, and modeled multilayer growth over regular-shaped defects. Further, the printability of the characterized native defects was studied with the SEMATECH-Berkeley Actinic Inspection Tool (AIT), an EUV mask-imaging microscope at Lawrence Berkeley National Laboratory (LBNL). Printability of the modeled regular-shaped defects, which were propagated up the multilayer stack using level-set growth model was studied using defect printability simulations implementing the waveguide algorithm. Good comparison was observed between AIT and the simulation results, thus demonstrating that multilayer growth over a defect is primarily a function of a defect's width and height, irrespective of its shape. This would allow us to predict printability of the arbitrarily-shaped native EUV mask defects in a systematic and robust manner.
Investigation Of Buried Euv Mask Defect Printability Using Actinic Inspection And Fast Simulation
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Author :
language : en
Publisher:
Release Date : 2009
Investigation Of Buried Euv Mask Defect Printability Using Actinic Inspection And Fast Simulation written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009 with categories.
The fast simulator RADICAL and the Actinic Inspection Tool (AIT) are used in advance of availability of high volume manufacturing quality exposure tools, resists, and masks to assess the expected defect printability levels in production conditions. AIT images are analyzed to qualitatively demonstrate general trends in defect printability: defects smaller than 0.5nm tall on the multilayer surface can cause an unacceptable critical dimension (CD) change, CD change increases for taller defects, and defect printability varies asymmetrically through focus. RADICAL is used to derive quantitative limits for defect size and demonstrate the effects of focus and illumination for 22nm and 16nm dense lines. For 22nm dense lines at best focus a 0.8nm tall defect causes a 10% CD change. For 16nm lines a 0.4nm tall defect causes a 10% CD change. The CD is shown to be more sensitive to buried defects out of focus, but less sensitive to defects in focus if annular or dipole illumination is used.
Key Challenges In Euv Mask Technology
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Author : Yow-Gwo Wang
language : en
Publisher:
Release Date : 2005
Key Challenges In Euv Mask Technology written by Yow-Gwo Wang and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2005 with categories.
This dissertation focuses on issues related to extreme ultraviolet (EUV) lithography mask technology: mask inspection and mask 3D effects on imaging performance. Actinic (at- wavelength) mask inspection (both blank and patterned mask) is of critical concern for EUV lithography. In this dissertation, systematic studies exploring the optimal optical system design to improve the defect detection sensitivity for both actinic mask blank and patterned mask inspection tools using EUV light are presented. For EUV mask blank in- spection, a complete discussion is conducted to compare the conventional bright field method and the Zernike phase contrast method on their phase defect detection sensitivity by thin mask simulations and experiments using the SHARP EUV microscope at Lawrence Berke- ley National Laboratory (LBNL). The study shows that higher defect detection sensitivity and in-focus inspection capability can be achieved by the Zernike phase contrast method, while the conventional bright field method needs through-focus scanning and results in lower defect detection sensitivity. Experimental results show that a programmed defect as small as 0.35 nm in height is detected at best focus with a signal-to-noise ratio (SNR) ≈ 8 by the Zernike phase contrast method. With the considerations of various noise sources and system design, the thin mask simulation results show that the dark field method has better detection efficiency in inspection mode, while the Zernike phase contrast method is better in review mode (pixel size ≤ 25 nm). Further, the impact of pixel size, EUV source type, and photon collection efficiency for a dark field based actinic blank inspection tool is discussed by thin mask simulation. The simulation results show the complex correlation between each parameter on defect inspection efficiency and also show that 10-watt EUV source power and 100 nm pixel size are needed to capture a phase defect of height 0.5 nm. For EUV patterned mask inspection, the possibility of using the optimum phase shift in the pupil plane to improve inspection efficiency is discussed using a thin mask model. Then the nature of the EUV mask pattern defect is analyzed by its near field distribution using a thick mask model. The simulation results indicate that, as a result of 3D effects leading to phase artifacts, pattern defects cannot be simply treated as ideal absorber defects. The results can affect the choice of optimal patterned mask inspection tool design. Moreover, a study of a bright field based EUV actinic pattern inspection tool design using a hybrid (2D + 3D) model is presented, showing that the impact of noise sources and optical design on critical pattern defects detection sensitivity. The study shows that introducing a − 50 nm defocus into the inspection system can improve the SNR by 50%. The impact of EUV sub-resolution assist feature (SRAF) on mitigation of mask 3D effects is discussed by rigorous 3D modeling. The simulation results show that introducing SRAFs in the mask design induces even stronger effective single pole aberration into the imaging system to balance the Bossung curve. Asymmetric SRAFs pattern placement can achieve a 21% improvement of the process window. Moreover, the complex interaction between the main feature and the SRAFs is analyzed by systematic position sensitivity studies. Bossung tilt sensitivity with respect to the relative positions between main feature and SRAFs is shown, which indicates that different location precision requirements are needed for SRAFs during the mask-making process.