Thermal Computations For Electronics
DOWNLOAD eBooks
Download Thermal Computations For Electronics PDF/ePub or read online books in Mobi eBooks. Click Download or Read Online button to get Thermal Computations For Electronics book now. This website allows unlimited access to, at the time of writing, more than 1.5 million titles, including hundreds of thousands of titles in various foreign languages. If the content not found or just blank you must refresh this page
Thermal Computations For Electronics
DOWNLOAD eBooks
Author : Gordon N. Ellison
language : en
Publisher: CRC Press
Release Date : 2020-05-13
Thermal Computations For Electronics written by Gordon N. Ellison and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-05-13 with Technology & Engineering categories.
The first edition of Thermal Computations for Electronics: Conductive, Radiative, and Convective Air Cooling was based on the author's lecture notes that he developed over the course of nearly 40 years of thermal design and analysis activity, the last 15 years of which included teaching a university course at the senior undergraduate and graduate levels. The subject material was developed from publications of respected researchers and includes topics and methods original to this author. Numerous students have contributed to both the first and second editions, the latter corrected, sections rewritten (e.g., radiation spatial effects, Green's function properties for thermal spreading, 1-D FEA theory and application), and some new material added. The flavor and organization of the first edition have been retained, whereby the reader is guided through the analysis process for systems and then components. Important new material has been added regarding altitude effects on forced and buoyancy driven airflow and heat transfer. The first 20% of the book is devoted to the prediction of airflow and well-mixed air temperatures in systems, circuit board channels, and heat sinks, followed by convective (PCB-mounted components included), radiative, and conductive heat transfer and the resultant temperatures in electronic equipment. Detailed application examples illustrate a variety of problems. Downloads (from the CRC website) include: MathcadTM text examples, exercise solutions (adopting professors only) plus PDF lecture aids (professors only), and a tutorial (Chapter 14) using free FEA software to solve a thermal spreading problem. This book is a valuable professional resource for self-study and is ideal for use in a course on electronics cooling. It is well-suited for a first course in heat transfer where applications are as important as theory.
Thermal Computations For Electronic Equipment
DOWNLOAD eBooks
Author : Gordon N. Ellison
language : en
Publisher:
Release Date : 1989
Thermal Computations For Electronic Equipment written by Gordon N. Ellison and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1989 with Science categories.
Thermal Computations For Electronics
DOWNLOAD eBooks
Author : Gordon Ellison
language : en
Publisher: CRC Press
Release Date : 2010-11-08
Thermal Computations For Electronics written by Gordon Ellison and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2010-11-08 with Technology & Engineering categories.
A total revision of the author’s previous work, Thermal Computations for Electronics: Conductive, Radiative, and Convective Air Cooling is a versatile reference that was carefully designed to help readers master mathematical calculation, prediction, and application methods for conductive, radiative, and convective heat transfer in electronic equipment. Presenting material in a way that is practical and useful to engineers and scientists, as well as engineering students, this book provides very detailed text examples and their solutions. This approach helps users at all levels of comprehension to strengthen their grasp of the subject and detect their own calculation errors. The beginning of this book is largely devoted to prediction of airflow and well-mixed air temperatures in systems and heat sinks, after which it explores convective heat transfer from heat sinks, circuit boards, and components. Applying a systematic presentation of information to enhance understanding and computational practice, this book: Provides complete mathematical derivations and supplements formulae with design plots Offers complete exercise solutions (MathcadTM worksheets and PDF images of Mathcad worksheets), lecture aids (landscape-formatted PDF files), and text-example Mathcad worksheets for professors adopting this book Addresses topics such as methods for multi-surface radiation exchange, conductive heat transfer in electronics, and finite element theory with a variational calculus method explained for heat conduction Presents mathematical descriptions of large thermal network problem formulation Discusses comprehensive thermal spreading resistance theory, and includes steady-state and time-dependent problems This reference is useful as a professional resource and also ideal for use in a complete course on the subject of electronics cooling, with its suggested course schedule and other helpful advice for instructors. Selected sections may be used as application examples in a traditional heat transfer course or to help professionals improve practical computational applications.
Thermal Measurements In Electronics Cooling
DOWNLOAD eBooks
Author : Kaveh Azar
language : en
Publisher: CRC Press
Release Date : 2020-08-26
Thermal Measurements In Electronics Cooling written by Kaveh Azar and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2020-08-26 with Technology & Engineering categories.
Filled with careful explanations, step-by-step instructions, and useful examples, this handbook focuses on real-world considerations and applications of thermal measurement methods in electronics cooling. Fifteen experts in thermal engineering combine their expertise to create a complete guide to this complex topic. This practical reference covers all aspects of thermal characterization in electronics cooling and thermal management. The first part of the book introduces the concept of electronics cooling and its associated thermal phenomenon and explains why experimental investigation is required. Subsequent chapters explain methods of measuring different parameters and introduce relevant examples. Sources for locating needed equipment, tables, checklists, and to-do lists are included. Sample calculations and methodologies for error analysis ensure that you can put this valuable information to use in your work.
Advanced Thermal Design Of Electronic Equipment
DOWNLOAD eBooks
Author : Ralph Remsburg
language : en
Publisher: Springer Science & Business Media
Release Date : 1998-02-28
Advanced Thermal Design Of Electronic Equipment written by Ralph Remsburg and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998-02-28 with Computers categories.
With today's high density, high performance electronic systems, packaging and more specifically thermal engineering has become the critical factor that limits on-time product introduction and reliability in the field. This book serves as a reference for engineers who must predict the thermal performance of a company's latest product as well as the technicians who must quickly solve the problem of an overheating chip in a product that is already on the shelves.
Air Cooling Technology For Electronic Equipment
DOWNLOAD eBooks
Author : Sung Jin Kim
language : en
Publisher: CRC Press
Release Date : 1996-04-26
Air Cooling Technology For Electronic Equipment written by Sung Jin Kim and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996-04-26 with Technology & Engineering categories.
Clear your bookcase of references containing bits and pieces of useful information and replace them with this thorough, single-volume guide to thermal analysis. Air Cooling Technology for Electronic Equipment is a helpful, practical resource that answers questions frequently asked by thermal and packaging engineers grappling with today's demand for increased thermal control in electronics. Superbly organized for quick reference, the book dedicates each chapter to answering fundamental questions, such as: What is the optimal spacing between the printed circuit boards? What is a good estimate of the heat transfer coefficient and the associate pressure drop for forced convection over package arrays? How are heat transfer and fluid flow characteristics in the entrance region different from those in the fully developed region? What is the effect of substrate conduction on convection cooling? The chapters, written by engineers and engineering educators who are experts in electronic cooling, are packed with details and present the latest developments in air cooling techniques and thermal design guidelines. They provide problem-solving analyses that are jargon-free, straightforward, and easy to understand. Air Cooling Technology for Electronic Equipment is a handy source of technical information for anyone who wants to get the most out of air cooling.
Thermal Design Of Electronic Equipment
DOWNLOAD eBooks
Author : Ralph Remsburg
language : en
Publisher: CRC Press
Release Date : 2000-09-27
Thermal Design Of Electronic Equipment written by Ralph Remsburg and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000-09-27 with Technology & Engineering categories.
In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.
Thermal Management Of Microelectronic Equipment
DOWNLOAD eBooks
Author : Lian-Tuu Yeh
language : en
Publisher: Asme Press Book Series on Elec
Release Date : 2002
Thermal Management Of Microelectronic Equipment written by Lian-Tuu Yeh and has been published by Asme Press Book Series on Elec this book supported file pdf, txt, epub, kindle and other format this book has been release on 2002 with Technology & Engineering categories.
With an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels. This new book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies. While focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment. The book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume. The authors present a comprehensive convective heat transfer catalog that includes correlations of heat transfer for various physical configurations and thermal boundary conditions. They also provide property tables of solids and fluids. Lian-Tuu Yeh and Richard Chu are recognized experts in the field of thermal management of electronic systems and have a combined 60 years of experience in the defense and commercial industries.
Cooling Techniques For Electronic Equipment
DOWNLOAD eBooks
Author : Dave S. Steinberg
language : en
Publisher: Wiley-Interscience
Release Date : 1991-10-22
Cooling Techniques For Electronic Equipment written by Dave S. Steinberg and has been published by Wiley-Interscience this book supported file pdf, txt, epub, kindle and other format this book has been release on 1991-10-22 with Technology & Engineering categories.
Details infallible techniques for designing electronic hardware to withstand severe thermal environments. Using both SI and English units throughout, it presents methods for the development of various reliable electronic systems without the need of high-speed computers. It also offers mathematical modeling applications, using analog resistor networks, to provide the breakup of complex systems into numerous individual thermal resistors and nodes for those who prefer high-speed digital computer solutions to thermal problems.
Thermal Management Of Electronic Systems
DOWNLOAD eBooks
Author : Charles J. Hoogendoorn
language : en
Publisher: Springer Science & Business Media
Release Date : 1994
Thermal Management Of Electronic Systems written by Charles J. Hoogendoorn and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994 with Mathematics categories.
This volume presents an overview of recent developments in the thermal management of electronic systems. This is increasingly recognized as an important factor in current design methodology. The topics covered include thermal management in general, thermally induced failure, numerical and experimental analysis of systems at various packaging levels, channels and electronic components, measurement techniques, liquid cooling, thermal characterization, thermal stress and die attach defects.