Advances In Rapid Thermal And Integrated Processing
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Advances In Rapid Thermal And Integrated Processing
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Author : F. Roozeboom
language : en
Publisher: Springer Science & Business Media
Release Date : 2013-03-09
Advances In Rapid Thermal And Integrated Processing written by F. Roozeboom and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2013-03-09 with Science categories.
Rapid thermal and integrated processing is an emerging single-wafer technology in ULSI semiconductor manufacturing, electrical engineering, applied physics and materials science. Here, the physics and engineering of this technology are discussed at the graduate level. Three interrelated areas are covered. First, the thermophysics of photon-induced annealing of semiconductor and related materials, including fundamental pyrometry and emissivity issues, the modelling of reactor designs and processes, and their relation to temperature uniformity. Second, process integration, treating the advances in basic equipment design, scale-up, integrated cluster-tool equipment, including wafer cleaning and integrated processing. Third, the deposition and processing of thin epitaxial, dielectric and metal films, covering selective deposition and epitaxy, integrated processing of layer stacks, and new areas of potential application, such as the processing of III-V semiconductor structures and thin- film head processing for high-density magnetic data storage.
Advances In Rapid Thermal And Integrated Processing
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Author : F. Roozeboom
language : en
Publisher:
Release Date : 2014-01-15
Advances In Rapid Thermal And Integrated Processing written by F. Roozeboom and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-01-15 with categories.
Rapid Thermal And Integrated Processing V Volume 429
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Author : J. C. Gelpey
language : en
Publisher:
Release Date : 1996-10-14
Rapid Thermal And Integrated Processing V Volume 429 written by J. C. Gelpey and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1996-10-14 with Technology & Engineering categories.
This book is the latest in a continuing series on rapid thermal processing and related topics. It embraces a diversity of research, development and manufacturing activities that require rapid thermal and integrated processing techniques which are recognized by their acronyms, such as rapid thermal annealing (RTA), rapid thermal processing (RTP), rapid thermal chemical vapor deposition (RTCVP), rapid thermal oxidation (RTO), and others. This fifth anniversary volume reports notable advances in the use of rapid thermal techniques in processing science and technology, and for process control in industrial fabrication facilities. It is organized around progress obtained through: evaluation methodology; equipment and process modelling; temperature control; defects and diffusion associated with annealing; metallizations such as silicidation; novel processing of sol-gel and magnetic films; dielectric growth and deposition; and silicon or silicon-germanium film deposition.
Advances In Rapid Thermal Processing
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Author : Fred Roozeboom
language : en
Publisher: The Electrochemical Society
Release Date : 1999
Advances In Rapid Thermal Processing written by Fred Roozeboom and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 1999 with Technology & Engineering categories.
Rapid Thermal And Integrated Processing
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Author :
language : en
Publisher:
Release Date : 1997
Rapid Thermal And Integrated Processing written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1997 with Rapid thermal processing categories.
Rapid Thermal Processing
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Author : Richard B. Fair
language : en
Publisher: Academic Press
Release Date : 2012-12-02
Rapid Thermal Processing written by Richard B. Fair and has been published by Academic Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-02 with Technology & Engineering categories.
This is the first definitive book on rapid thermal processing (RTP), an essential namufacturing technology for single-wafer processing in highly controlled environments. Written and edited by nine experts in the field, this book covers a range of topics for academics and engineers alike, moving from basic theory to advanced technology for wafer manufacturing. The book also provides new information on the suitability or RTP for thin film deposition, junction formation, silicides, epitaxy, and in situ processing. Complete discussions on equipment designs and comparisons between RTP and other processing approaches also make this book useful for supplemental information on silicon processing, VLSI processing, and integrated circuit engineering.
Rapid Thermal And Other Short Time Processing Technologies
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Author : Fred Roozeboom
language : en
Publisher: The Electrochemical Society
Release Date : 2000
Rapid Thermal And Other Short Time Processing Technologies written by Fred Roozeboom and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000 with Technology & Engineering categories.
The proceedings from this May 2000 symposium illustrate the range of applications in Rapid Thermal Processing (RTP). The refereed papers cover a variety of issues, such as ultra-shallow junctions; contacts for nanoscale CMOS; gate stacks; new applications of RTP, such as for the enhanced crystalization of amorphous silicon thin films; and advances on RTP systems and process monitoring, including optimizing and controlling gas flows in an RTCVD reactor. Most presentations are supported by charts and other graphical data. c. Book News Inc.
Rapid Thermal And Integrated Processing Vii
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Author : Mehmet C. Öztürk
language : en
Publisher: Cambridge University Press
Release Date : 2014-06-05
Rapid Thermal And Integrated Processing Vii written by Mehmet C. Öztürk and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2014-06-05 with Technology & Engineering categories.
The MRS proceedings series on rapid thermal processing (RTP) has become the predominant international forum for research in this exciting and fast-growing field. In particular, thisvolume in the series presents work in traditional RTP processes such as dielectric growth, annealing and silicides, as well as developments in novel modelling and integrated processes. Papers on equipment issues illustrate that problems such as temperature uniformity and measurement, traditionally viewed as limitations for RTP technology, are well on the way to being resolved. Manufacturing aspects of RTP and the successful integration of RTP into production semiconductor fabs are also addressed. Topics include: RTP equipment - modelling and new concepts; temperature measurement and control in RTP equipment; MOSFET gate stack engineering; MOSFET channel and source/drain engineering; silicides; and new applications of rapid thermal processing.
Rapid Thermal And Integrated Processing Iv Volume 470
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Author : Jeffrey C. Gelpey
language : en
Publisher: Materials Research Society
Release Date : 1998-01-09
Rapid Thermal And Integrated Processing Iv Volume 470 written by Jeffrey C. Gelpey and has been published by Materials Research Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998-01-09 with Technology & Engineering categories.
The MRS proceedings series on rapid thermal processing (RTP) has become the predominant international forum for research in this exciting and fast-growing field. In particular, this book in the series clearly indicates that the science of RTP is increasingly better understood and that equipment simulation and engineering have matured. With the so-called 'second generation' equipment vendors are providing useful and production-worthy solutions to the most pertinent problems within RTP - temperature measurement and reproducability. For that reason, the issues of temperature calibration and metrology, along with the International Temperature Scale, are featured. The evaluation and modelling of furnace, mini-bath and single-wafer RTP furnaces as the thermal method of choice are also addressed. Interesting developments are reported in the processing of dielectrics. Applications outside the field of silicon semiconductors are also presented. Topics include: measurement; RTCVD; modelling and manufacturing; integrated processing; silicides; annealing and defects; dielectrics; and RTP of III-V materials and other novel applications.
Reduced Thermal Processing For Ulsi
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Author : R.A. Levy
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06
Reduced Thermal Processing For Ulsi written by R.A. Levy and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Science categories.
As feature dimensions of integrated circuits shrink, the associated geometrical constraints on junction depth impose severe restrictions on the thermal budget for processing such devices. Furthermore, due to the relatively low melting point of the first aluminum metallization level, such restrictions extend to the fabrication of multilevel structures that are now essential in increasing packing density of interconnect lines. The fabrication of ultra large scale integrated (ULSI) devices under thermal budget restrictions requires the reassessment of existing and the development of new microelectronic materials and processes. This book addresses three broad but interrelated areas. The first area focuses on the subject of rapid thermal processing (RTP), a technology that allows minimization of processing time while relaxing the constraints on high temperature. Initially developed to limit dopant redistribution, current applications of RTP are shown here to encompass annealing, oxidation, nitridation, silicidation, glass reflow, and contact sintering. In a second but complementary area, advances in equipment design and performance of rapid thermal processing equipment are presented in conjunction with associated issues of temperature measurement and control. Defect mechanisms are assessed together with the resulting properties of rapidly deposited and processed films. The concept of RTP integration for a full CMOS device process is also examined together with its impact on device characteristics.