Interconnect And Contact Metallization For Ulsi

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Interconnect And Contact Metallization For Ulsi

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Author : G. S. Mathad
language : en
Publisher: The Electrochemical Society
Release Date : 2000

Interconnect And Contact Metallization For Ulsi written by G. S. Mathad and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2000 with Science categories.

Proceedings Of The Symposia On Interconnects Contact Metallization And Multilevel Metallization And Reliability For Semiconductor Devices Interconnects And Thin Insulator Materials

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Author : T. O. Herndon
language : en
Publisher:
Release Date : 1993

Proceedings Of The Symposia On Interconnects Contact Metallization And Multilevel Metallization And Reliability For Semiconductor Devices Interconnects And Thin Insulator Materials written by T. O. Herndon and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1993 with Technology & Engineering categories.

Advanced Nanoscale Ulsi Interconnects Fundamentals And Applications

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Author : Yosi Shacham-Diamand
language : en
Publisher: Springer Science & Business Media
Release Date : 2009-09-19

Advanced Nanoscale Ulsi Interconnects Fundamentals And Applications written by Yosi Shacham-Diamand and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2009-09-19 with Science categories.

In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.

Advanced Interconnects For Ulsi Technology

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Author : Mikhail Baklanov
language : en
Publisher: John Wiley & Sons
Release Date : 2012-04-02

Advanced Interconnects For Ulsi Technology written by Mikhail Baklanov and has been published by John Wiley & Sons this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-04-02 with Technology & Engineering categories.

Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.

Handbook Of Semiconductor Manufacturing Technology

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Author : Yoshio Nishi
language : en
Publisher: CRC Press
Release Date : 2017-12-19

Handbook Of Semiconductor Manufacturing Technology written by Yoshio Nishi and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017-12-19 with Technology & Engineering categories.

Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.

Advanced Interconnects And Contacts Volume 564

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Author : Daniel C. Edelstein
language : en
Publisher:
Release Date : 1999-10-07

Advanced Interconnects And Contacts Volume 564 written by Daniel C. Edelstein and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1999-10-07 with Technology & Engineering categories.

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

Proceedings Of The Symposium On Interconnect And Contact Metallization

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Author : Harzara S. Rathore
language : en
Publisher: The Electrochemical Society
Release Date : 1998

Proceedings Of The Symposium On Interconnect And Contact Metallization written by Harzara S. Rathore and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 1998 with Computers categories.

Copper Interconnects New Contact Metallurgies Structures And Low K Interlevel Dielectrics

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Author :
language : en
Publisher: The Electrochemical Society
Release Date : 2003

Copper Interconnects New Contact Metallurgies Structures And Low K Interlevel Dielectrics written by and has been published by The Electrochemical Society this book supported file pdf, txt, epub, kindle and other format this book has been release on 2003 with Electronic packaging categories.

Electromigration In Metals

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Author : Paul S. Ho
language : en
Publisher: Cambridge University Press
Release Date : 2022-05-12

Electromigration In Metals written by Paul S. Ho and has been published by Cambridge University Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-05-12 with Science categories.

Learn to assess electromigration reliability and design resilient chips, building from fundamental physics to advanced methodologies.

Handbook Of Semiconductor Interconnection Technology

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Author : Geraldine Cogin Shwartz
language : en
Publisher: CRC Press
Release Date : 2006-02-22

Handbook Of Semiconductor Interconnection Technology written by Geraldine Cogin Shwartz and has been published by CRC Press this book supported file pdf, txt, epub, kindle and other format this book has been release on 2006-02-22 with Technology & Engineering categories.

First introduced about a decade ago, the first edition of the Handbook of Semiconductor Interconnection Technology became widely popular for its thorough, integrated treatment of interconnect technologies and its forward-looking perspective. The field has grown tremendously in the interim and many of the "likely directions" outlined in the first ed