Reliability In Very Large Scale Integrated Circuits

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Reliability In Very Large Scale Integrated Circuits

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Author : Martyn Simon Davies
language : en
Publisher:
Release Date : 1992

Reliability In Very Large Scale Integrated Circuits written by Martyn Simon Davies and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1992 with Integrated circuits categories.

Vlsi Very Large Scale Integrated Circuits Device Reliability Models

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Author : D. Coit
language : en
Publisher:
Release Date : 1984

Vlsi Very Large Scale Integrated Circuits Device Reliability Models written by D. Coit and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1984 with categories.

This report details a study in which the objective was to develop failure rate prediction models for VLSI, Hybrid, analog microprocessor, and VHSIC devices. A description is given of the various phases involved in reliability prediction model development, such as; literature collection/review, investigation of failure modes, failure rate data collection, statistical analysis methodologies, model factors quantification, and model validation. For VLSI, Hybrid and analog microprocessor devices, the models are given in a form which can easily be included in MIL-HDBK-217. For VHSIC devices, this effort was necessarily limited to the identification of necessary model factors (attributes) which should be included in a quantitative model acceptable for inclusion in MIL-HDBK-217. This effort was necessarily limited to the development of a qualitative reliability prediction model due to the lack of available data on VHSIC devices at the time of this study. Keywords include: VLSI, Hybrid microcircuit, Integrated circuit, Failure rate, MIL-HDBK-217, and Reliability prediction.

A Nonstatistical Approach To The Reliability Assessment Of Very Large Scale Integrated Circuits

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Author : Michael James Satterfield
language : en
Publisher:
Release Date : 1987

A Nonstatistical Approach To The Reliability Assessment Of Very Large Scale Integrated Circuits written by Michael James Satterfield and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1987 with categories.

Rapid Reliability Assessment Of Vlsics

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Author : A P Dorey
language : en
Publisher:
Release Date : 1990-04-30

Rapid Reliability Assessment Of Vlsics written by A P Dorey and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1990-04-30 with categories.

Reliability Guidelines For The Procurement And Use Of Large Scale Integrated Circuits

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Author : Theodore R. Myers
language : en
Publisher:
Release Date : 1970

Reliability Guidelines For The Procurement And Use Of Large Scale Integrated Circuits written by Theodore R. Myers and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1970 with Integrated circuits categories.

Large Scale Integration (LSI) promises many advantages to the designer of state-of-the-art electronic systems in size, weight, and cost reduction while enhancing performance and reliability. However, successful transition to this new technology presents new challenges. Traditional quality assurance and reliability assessment practices designed around large volume part procurements must be re-examined. Most likely a much closer interface will be established between the vendor and user. The reliability and quality assurance staff is in a unique position to develop and lead this combined effort. Technical Monograph 70-2 develops an approach for a coincident reliability program and considers the reliability impact of processing and design decisions. Expected and observed failure modes and mechanisms, including packaging problems, are discussed. Guidelines are included for a quality assurance program covering process control, screening, and LSI testing. Finally, a method is outlined for predicting LSI component failure rates. (Author).

Prototype Rule Based Reliability Analysis For Vlsi Circuit Design

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Author :
language : en
Publisher:
Release Date : 1994

Prototype Rule Based Reliability Analysis For Vlsi Circuit Design written by and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 1994 with categories.

This report describes the development and application of parametric and geometry based macro-models of hot-carrier induced dynamic degradation in MOS VLSI circuits. Previously, a simulation based approach has been used for reliability analysis, but this is inefficient for reliability assessment of very large scale integrated circuits. Geometry-based macro-models for hot-carrier reliability estimation have been developed. The macro-models express hot-carrier damage as functions of designable parameters such as transistor size (W), output loading capacitance (C1) and the input signal slew rate (a). A prototype rule- based reliability diagnosis tool, iRULE, has been developed. This tool uses the macro-models for designing hot-carrier resistant circuits without the need for transient reliability simulations. This provides the ability to analyze very large circuits with more than one million transistors on a workstation in a short amount of time. This report also describes a fast timing reliability simulation tool, ILLIADS-R, that can accurately estimate hot-carrier degradation while providing several orders of magnitude speed up over traditional transistor-level circuit simulators. Reliability, Hot-carrier degradation, VLSI CMOS Circuits, Simulation.

Testing And Reliable Design Of Cmos Circuits

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Author : Niraj K. Jha
language : en
Publisher: Springer Science & Business Media
Release Date : 2012-12-06

Testing And Reliable Design Of Cmos Circuits written by Niraj K. Jha and has been published by Springer Science & Business Media this book supported file pdf, txt, epub, kindle and other format this book has been release on 2012-12-06 with Computers categories.

In the last few years CMOS technology has become increas ingly dominant for realizing Very Large Scale Integrated (VLSI) circuits. The popularity of this technology is due to its high den sity and low power requirement. The ability to realize very com plex circuits on a single chip has brought about a revolution in the world of electronics and computers. However, the rapid advance ments in this area pose many new problems in the area of testing. Testing has become a very time-consuming process. In order to ease the burden of testing, many schemes for designing the circuit for improved testability have been presented. These design for testability techniques have begun to catch the attention of chip manufacturers. The trend is towards placing increased emphasis on these techniques. Another byproduct of the increase in the complexity of chips is their higher susceptibility to faults. In order to take care of this problem, we need to build fault-tolerant systems. The area of fault-tolerant computing has steadily gained in importance. Today many universities offer courses in the areas of digital system testing and fault-tolerant computing. Due to the impor tance of CMOS technology, a significant portion of these courses may be devoted to CMOS testing. This book has been written as a reference text for such courses offered at the senior or graduate level. Familiarity with logic design and switching theory is assumed. The book should also prove to be useful to professionals working in the semiconductor industry.

Vlsi Soc Design For Reliability Security And Low Power

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Author : Youngsoo Shin
language : en
Publisher: Springer
Release Date : 2016-09-12

Vlsi Soc Design For Reliability Security And Low Power written by Youngsoo Shin and has been published by Springer this book supported file pdf, txt, epub, kindle and other format this book has been release on 2016-09-12 with Computers categories.

This book contains extended and revised versions of the best papers presented at the 23rd IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2015, held in Daejeon, Korea, in October 2015. The 10 papers included in the book were carefully reviewed and selected from the 44 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the current trend toward increasing chip integration and technology process advancements bringing about new challenges both at the physical and system-design levels, as well as in the test of these systems.

Lifetime Reliability Aware Design Of Integrated Circuits

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Author : Mohsen Raji
language : en
Publisher: Springer Nature
Release Date : 2022-11-16

Lifetime Reliability Aware Design Of Integrated Circuits written by Mohsen Raji and has been published by Springer Nature this book supported file pdf, txt, epub, kindle and other format this book has been release on 2022-11-16 with Technology & Engineering categories.

This book covers the state-of-the-art research in design of modern electronic systems used in safety-critical applications such as medical devices, aircraft flight control, and automotive systems. The authors discuss lifetime reliability of digital systems, as well as an overview of the latest research in the field of reliability-aware design of integrated circuits. They address modeling approaches and techniques for evaluation and improvement of lifetime reliability for nano-scale CMOS digital circuits, as well as design algorithms that are the cornerstone of Computer Aided Design (CAD) of reliable VLSI circuits. In addition to developing lifetime reliability analysis and techniques for clocked storage elements (such as flip-flops), the authors also describe analysis and improvement strategies targeting commercial digital circuits.

Algorithms And Methodologies For Interconnect Reliability Analysis Of Integrated Circuits

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Author : Palkesh Jain
language : ca
Publisher:
Release Date : 2017

Algorithms And Methodologies For Interconnect Reliability Analysis Of Integrated Circuits written by Palkesh Jain and has been published by this book supported file pdf, txt, epub, kindle and other format this book has been release on 2017 with categories.

The phenomenal progress of computing devices has been largely made possible by the sustained efforts of semiconductor industry in innovating techniques for extremely large-scale integration. Indeed, gigantically integrated circuits today contain multi-billion interconnects which enable the transistors to talk to each other -all in a space of few mm2. Such aggressively downscaled components (transistors and interconnects) silently suffer from increasing electric fields and impurities/defects during manufacturing. Compounded by the Gigahertz switching, the challenges of reliability and design integrity remains very much alive for chip designers, with Electro migration (EM) being the foremost interconnect reliability challenge. Traditionally, EM containment revolves around EM guidelines, generated at single-component level, whose non-compliance means that the component fails. Failure usually refers to deformation due to EM -manifested in form of resistance increase, which is unacceptable from circuit performance point of view. Subsequent aspects deal with correct-by-construct design of the chip followed by the signoff-verification of EM reliability. Interestingly, chip designs today have reached a dilemma point of reduced margin between the actual and reliably allowed current densities, versus, comparatively scarce system-failures. Consequently, this research is focused on improved algorithms and methodologies for interconnect reliability analysis enabling accurate and design-specific interpretation of EM events. In the first part, we present a new methodology for logic-IP (cell) internal EM verification: an inadequately attended area in the literature. Our SPICE-correlated model helps in evaluating the cell lifetime under any arbitrary reliability speciation, without generating additional data - unlike the traditional approaches. The model is apt for today's fab less eco-system, where there is a) increasing reuse of standard cells optimized for one market condition to another (e.g., wireless to automotive), as well as b) increasing 3rd party content on the chip requiring a rigorous sign-off. We present results from a 28nm production setup, demonstrating significant violations relaxation and flexibility to allow runtime level reliability retargeting. Subsequently, we focus on an important aspect of connecting the individual component-level failures to that of the system failure. We note that existing EM methodologies are based on serial reliability assumption, which deems the entire system to fail as soon as the first component in the system fails. With a highly redundant circuit topology, that of a clock grid, in perspective, we present algorithms for EM assessment, which allow us to incorporate and quantify the benefit from system redundancies. With the skew metric of clock-grid as a failure criterion, we demonstrate that unless such incorporations are done, chip lifetimes are underestimated by over 2x. This component-to-system reliability bridge is further extended through an extreme order statistics based approach, wherein, we demonstrate that system failures can be approximated by an asymptotic kth-component failure model, otherwise requiring costly Monte Carlo simulations. Using such approach, we can efficiently predict a system-criterion based time to failure within existing EDA frameworks. The last part of the research is related to incorporating the impact of global/local process variation on current densities as well as fundamental physical factors on EM. Through Hermite polynomial chaos based approach, we arrive at novel variations-aware current density models, which demonstrate significant margins (> 30 %) in EM lifetime when compared with the traditional worst case approach. The above research problems have been motivated by the decade-long work experience of the author dealing with reliability issues in industrial SoCs, first at Texas Instruments and later at Qualcomm.